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The M5Stack Stamp-P4 Module is a compact, high-performance embedded platform built around the ESP32-P4NRW32, designed for demanding applications such as UI rendering, image processing, and edge AI.
It features a 32-bit RISC-V dual-core processor running at up to 360MHz, alongside a low-power single-core coprocessor at 40MHz for efficient background tasks. With 16MB of Flash and 32MB of PSRAM, it provides the memory needed to handle more complex workloads and data-heavy applications.
For multimedia and human-machine interaction, the module includes a MIPI-CSI camera interface and a MIPI-DSI display interface, enabling direct connection to cameras and high-resolution displays. It also integrates a hardware H.264 encoder, ISP image signal processor, and pixel processing accelerator, allowing for smooth video capture, encoding, and graphical interface performance.
The Stamp-P4 supports a wide range of high-speed interfaces, including USB 2.0 OTG HS, Ethernet (GMAC), and SDIO 3.0, making it suitable for connected and data-intensive applications. Its flexible form factor supports multiple mounting options, with compatibility for 1.27mm and 2.00mm pitch SMT as well as standard 2.54mm DIP headers, making integration into custom PCB designs straightforward.
Overall, it provides a capable platform for rapid prototyping and deployment of embedded systems requiring strong processing, connectivity, and multimedia support.
| SoC | ESP32-P4NRW32 (RISC-V 32-bit high-performance dual-core processor 360 MHz + RISC-V 32-bit single-core low-power coprocessor 40 MHz) |
| Flash | 16MB |
| PSRAM | 32MB |
| DC-DC | SY8089AAAC |
| Overvoltage Protection | AW32901FCR, supports input voltage protection greater than 6V |
| Input Voltage | DC 5V |
| Power Consumption | Bare board operation: 5V@30.76mA Bare board deep sleep: 5V@360.84uA / 3.3V@343.90uA |
| Module Resource Interface | USB, UART, I2C, RMII, GPIO, MIPI CSI, MIPI DSI |
| Stamp Hole Lead-out Interface | 44 x GPIO (G0-G39, G41, G49, G50, G52) MIPI DSI (2-lane) USB HOST (USB2 OTG D+/-) CHIP_EN |
| Module Packaging | SMT: 1.27 / 2.00mm DIP: 2.54mm |
| BTB Expansion Interface | SDIO, MIPI CSI (2-lane) |
| BTB Interface Specification |
MIPI CSI: AXE516127DSDIO: HC-PBB40C-20DS-0.4V-2.5-02 |
| Operating Temperature | 0 ~ 40°C |
| Product Size | 29.8 x 22.0 x 4.3mm |
| Product Weight | 2.7g |


















